OSP process for PCB manufacture
The GLICOAT® range is a one-step OSP (Organic Solder Preservative) for PCB manufacture. By chemically reacting with copper, the active ingredient, a substituted imidazole derivative, GLICOAT®, produces a uniform, very thin and transparent organic coating on copper surfaces and in though holes in PCBs. The surface is suitable for lead-free assembly and multiple soldering.
GLICOAT® coatings have excellent heat resistance, are planar and compatible with “non-clean soldering fluxes” and lead-free solder pastes. They are optimally suited for use with PCBs and SMD technology as well as an alternative to HAL and other final surfaces. GLICOAT® can be applied horizontally and vertically and is particularly environmentally friendly.
System profile
- Uniform, semi-matt and planar deposition
- RoHS compliant, lead-free
- High stability against contamination
- Whisker inhibited
- Low viscosity for optimal wetting
- Stabilised against the formation of Sn(4+)
- Very good solder mask compatibility
Application profile
- Can be applied horizontally and vertically
- All components can be analysed
- Low working temperature
- Very good rinseability
OSP (Organic solder preservative)
GLICOAT® (OSP) creates a uniform, very thin, transparent and solderable organic coating on copper surfaces and in through holes in PCBs. Depending on the application, different variants are available.
