De-smear and metallising
- EC RESIN-ETCH
- EC NANOCARBITE
Electrolytes for electronics
- EC CU-PLATE 100
- EC SN-PLATE 200
Inner layer bonding agent
- EC THORN-BOND
Stabilisers and cleaners
- EC CU-CLEAN
Strippers
- EC RESIST-STRIP
- EC SN-STRIP HL
Developer and de-foamer
- EC EW-100
- EC FOAM-SHUT 100 and 900
Solder masking paint and resist pre-cleaning
- GLIBRITE®
End surfaces
- EC SN-PLATE 200
- GLICOAT®
- JPC IMMERSION GOLD®