Stabilisers and cleaners for PCB manufacture
The EC CU-CLEAN product family includes hydrogen peroxide stabilisers and cleaners for various applications in the electronics industry. These systems help to significantly reduce hydrogen peroxide decomposition.
EC CU-CLEAN FF (Final Finish) is used before the HAL process. It reliably removes paint residues for flawless tinning.
EC CU-CLEAN PF (Phenol-free) is a stabiliser for peroxide micro-etching and offers a low-cost alternative to persulphate micro-etching.
System profile
- Phenol-free system
- High stabilisation effect
- High cleaning effect
- Very high copper absorption (> 40 g/l) in all variants
- Low sulphate load / cargo
- 2-in-1 system
- Significant cost reduction compared to persulphate systems
- EC CU-CLEAN FF (Final Finish) for pre-cleaning before HAL
- EC CU-CLEAN PF (Phenol-free) as an alternative to persulphate micro-etching
- EC CU-CLEAN UC (Universal Clean), horizontal cleaner with minimised copper attack to remove organic contaminants or coatings (OSP, tarnish protection etc.)
Application profile
- Can be applied horizontally and vertically
- Can be analysed
EC CU-CLEAN FF – Stabiliser and HAL / Cleaner
The EC CU-CLEAN FF cleaner was developed for pre-cleaning or corroding prior to hot air levelling (HAL) or OSP coating. It removes oxides, developer or paint residues reliably without attaching the paint. By direct control of the hydrogen peroxide concentration and the temperature, the etch rate can be adjusted as desired and necessary. This is constant and independent of the copper concentration within the working range.
EC CU-CLEAN PF – Phenol-free stabiliser
EC CU-CLEAN PF was developed for pre-cleaning or decaping prior to hot air levelling (HAL) or OSP coating. It reliably removes oxides, developer and paint residues, but does so without attacking the paint. The etch rate is directly controlled by the hydrogen peroxide concentration and the temperature. The etch rate is constant and independent of the copper concentration within the working range. EC CU-CLEAN PF is phenol-free.
EC CU-CLEAN UC – Acidic cleaner
The acid surfactant mixture, EC CU-CLEAN UC, is used for cleaning and activating the metal surfaces. It reliably removes inorganic and organic contaminants, such as oils, fats or fingerprints. It optimally prepares the surface for the subsequent steps, such as micro-etching or OSP coating. It is low-foaming and can be applied both vertically and horizontally.
